Quartz glass wafer
Semiconductor industry (glass via TVG, passive device integration WL-IPD)
TGV has many through-holes with a diameter of micrometers in glass, making it the next generation semiconductor packaging substrate material. The high-quality TGV achieved through glass materials and hole processing technology can achieve miniaturization of various markets such as data centers, 5G communication networks, and LOT devices, as well as high-density packaging and GHz speed data processing.
Product Introduction
Optical communication (PLC optical splitter chip, AWG array waveguide grating chip)
Product Advantages
After more than 20 years of technological research and process exploration, the company's melting quartz technology has reached a leading position in China, with most product indicators reaching international advanced levels. In particular, the optical non-uniformity index of UV optical quartz glass is the first in the industry in China to achieve a level within 2 (1.985×10^-6), and the non-uniformity index stability of existing products can be maintained within 4.
a. The company pioneered the vertical single-lamp integrated deposition system, which integrates raw material pretreatment, reaction synthesis, and quartz growth modules.
b. Super-precise combustion control and liquid evaporation create a constant flow field to ensure high purity.
c. Excellent matching between the combustion chamber’s thermal field and the advanced deposition furnace's temperature field creates optimal synthesis interfaces and product cross-sections.
d. Advanced automation control enables consistent axial growth and axial symmetry.
e. Defect distribution after lateral extension is suppressed, and secondary defects are improved through precise trough thermal shaping.
f. Independent development of multi-stage precision annealing process reduces the impact of stress.
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Pure Height
Corrosion Resistant -
Low Coefficient Of Thermal Expansion
Resistant -
High Resistance To Radiation
Performance Parameter
Impurity Content（ppm）
Mechanical Property
Electrical Properties
Thermal Properties
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